The world's first semiconductor chip-level printer with narrow-edge printing enables high precision 3D step printing. It can print on chips under high precision pressure control.

It is applied in products like high-power diodes, MOSFET, DrMOS, multi-die clips, etc.

Printing in the X Axis

Frames are typically thin and have a significant difference in length-to-width ratio, making them prone to warping and forming curved surfaces. When printing in the narrow-edge direction, the squeegee can mitigate uneven printing caused by substrate or frame curvature. And it’s less affected by curvature. This ensures more uniform solder paste or epoxy print on pads, meeting the high planarity demands of advanced electronic packaging.

 Technology of On-chip Printing

The chip-level printer, equipped with on-chip printing technology, directly prints solder paste or epoxy on chips. This effectively prevents chip damage, overflow, and other issues caused by spot epoxy, ensuring product performance and stability.

Adaptability

Loading/Unloading in External Device: The chip-level printer places loading and unloading structures outside the machine, facilitating both single-machine and integrated operations.

Support 3D Printing：The machine supports 3D step printing, which means printing pads layer by layer to print more complex pad structures.

No adjustment for stencil change：There is no need to re-adjust parameters after stencil changes. This reduces unnecessary time waste and improves manufacture efficiency.

Printing Consistency

The stencil can undergo slight deformation during the printing process to ensure full conformity with the frame PAD. And high-precision stencils can ensure the consistency of the solder paste and pattern.

Closed-loop Pressure Control

ASMADE has independently developed a closed-loop pressure control system. The system ensures the squeegee pressure is self-adaptive and adjustable, and can be precisely controlled in different and complex situations. By enabling such refined control, the system achieves more uniform solder paste.

AOI Inspection

After solder paste is printed, the PCB board is transported into the AOI inspection machine immediately. In this way, the AOI inspection machine can directly assess the solder paste’s consistency and the stencil’s condition before other processes interfere with them.

About Us

ASMADE (SHENZHEN) TECHNOLOGY LIMITED, a national high-tech enterprise founded by international leading motion control expert team, gathered the industry's top packaging technology experts, focusing on the research and development of high-precision semiconductor equipment, manufacturing and sales.
The main machines are semiconductor packaging equipment, power device packaging equipment, MINI LED die bond equipment, intelligent control equipment and semiconductor packaging process management system.

Dedicated to providing one-stop semiconductor packaging process die bond solutions.