In recent years, with the rapid development of the panel industry and the crazy expansion of domestic manufacturers, the relationship between supply and demand of products has been basically eased, and manufacturers began to focus on the improvement of product "quality". The display panel industry will develop towards high-resolution graphics, curved surfaces, ultra-thin planes, lightness, bendability, high dynamic HDR, high contrast, and wide color gamut, resulting in the emergence of Mini LEDs.

According to predictions, Mini LED will officially explode and enter the commercialization stage in 2019. At present, mainstream global manufacturers have basically completed the research and development process of Mini LED backlights, entering the stage of small-scale sample or large-scale supply. Major domestic enterprises are also vigorously conducting process research to accelerate the process of putting them on the market.

Mini LED uses LED chips with a size of micrometers, and each Mini LED circuit board typically has thousands of chips and tens of thousands of solder joints to connect RGB three color chips. Such a large number of solder joints has brought great difficulty to the packaging of chips. Today, let's learn about printing technology together.

Compared to the traditional SMT printing process, Mini LED has reached the extreme requirements for the process. According to statistics, over 60% of welding defects are caused by the printing process. For precision printing of Mini LED, higher requirements are put forward for equipment (printing machine), accessories (steel mesh), and materials (solder paste), all of which are indispensable.