In 2019, the Mini LED equipment track was selected and began to invest in research and development; in 2020, it successfully launched a flip-chip COB die-bonding machine, and has cooperated with many panel and LED display manufacturers. Asmade Semiconductor is moving from behind the scenes to the front of the stage.

　　At ISLE 2021, Asmade Semiconductor is one of the few equipment manufacturers participating in the exhibition.

　　In addition to the flip-chip COB die-bonding machine that has been mass-produced and shipped, Asmade Semiconductor also exhibited the automated production line built in cooperation, as well as inspection and wafer rework solutions.

　　According to Zhang Ruiju, general manager of Asmade Semiconductor, the company's positioning is to "provide an overall solution for the Mini LED packaging process."

　　At this stage, Asmade Semiconductor mainly focuses on Mini LED die bonding machines. In the future, Asmade Semiconductor will gradually launch wafer rework machines, testing solutions, and create semi-automatic or fully automated production line solutions for customers, and pass the last-mile after-sales service , Realize the overall flip-chip COB solution of printing + die bonding + welding + lighting and testing + rework.

　　According to Gaogong New Display, flip-chip COB is recognized by the LED display industry as the optimal solution to achieve a smaller dot pitch. However, flip-chip COB also puts forward higher requirements for die bonders, mainly reflected in higher precision, faster speed, higher yield and larger substrates.

　　Asmade Semiconductor introduced that, for example, the accuracy requires position error <±15um and angle error <1°; the speed must ensure that the solder paste is pasted before denaturation; the yield rate is over 99.99%; and the substrate width must be over 200mm.

　　"Traditional equipment cannot meet the requirements." Based on the pain points such as efficiency and precision of the current die bonder, Asmade Semiconductor designed and developed the COB flip chip die bonder ASM3603.

　　ASM3603 can meet the size of 3*5mil-20*20mil chip die bonding, with dual state head alternate die bonding, good arrangement consistency; 6 wafer rings, complete RGB three-color die bonding in one clamping; can be connected in series/parallel, multiple machine connection; to achieve automation and mixing functions and other features. At the same time, ASM3603 can guarantee the die bonding yield rate of more than 99.99%.

　　ASM3603 is mainly used in Mini LED display. For Mini LED backlight, Asmade Semiconductor has also launched the backlight die bonder ASM3602.

　　Zhuoxing Semiconductor pointed out that the timeliness limitation of solder paste exists objectively, so the faster the die-bonding rate, the more LED chips per unit area. The ASM3602 uses dual state heads to bond the die at the same time, and the speed can reach 40K per hour.

　　In addition to fast speed, ASM3602 also has the features of double search system and wafer angle correction, vacuum leakage detection, vacuum adsorption of die bonding table and surface flatness correction, etc., to ensure the success rate of die bonding. Asmade Semiconductor other die bonder products also have these characteristics.

　　On the whole, Asmade Semiconductor flip-chip COB die-bonding machine production line for Mini LED direct display and Mini LED backlight is equipped with full flip-chip, tin printing process, fully automated production line, online full-process inspection, online wafer rework, Supports 6 major features such as wafer mixing.

　　Since the realization of mass production, Asmade Semiconductor has shipped dozens of Mini LED die-bonding machines, mainly panel manufacturers, and LED display manufacturers are also developing cooperation one after another.

　　"To make this device well, motion control and vision technology must be inseparable." Zhang Ruiju introduced that the company's founding team has more than 20 years of working experience in the field of industrial robots, and flip-chip COB is ushering in a broad space for development. Therefore, this track was selected to help the localization of key equipment in the semiconductor industry.